WAFER DELIVERY SYSTEM OF SEMICONDUCTOR EQUIPMENT

摘要

PURPOSE: A wafer delivery system of semiconductor equipment is provided to reduce damages of wafers due to wafer overlap by forming a plurality of slots for erecting the wafers on an upper surface of a wafer pusher and using a hanger members having grip grooves for catching the wafers. CONSTITUTION: A wafer delivery system includes a wafer cassette(21), a wafer pusher(23), and a couple of hanger members(31). The wafer cassette is used for receiving plural sheets of wafers after a predetermined process is finished. The wafer pusher includes a plurality of slots(23a) in order to lift the wafers from the wafer cassette to a predetermined position. A wafer chuck portion is installed in an inner face of the hanger members. The wafer chuck portion includes a plurality of grip grooves in order to catch the plural sheets of wafers lifted by the wafer pusher.