| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise efficiently a thermal conduction and electric insulating properties in a thermal conduction material which uses semiconductor ceramics (e.g. silicon carbide) as a thermal conduction filler. <P>SOLUTION: A silicon carbide 3 of particle size 50 to 100 μm, a silicon carbide 5 of particle size 5 to 10 μm and an alumina 7 of particle size 10 to 30 μm are mixed in a liquid silicone 1, whereby a thermal conduction filler (the silicon carbides 3, 5 and the alumina 7) was filled in the liquid silicone 1. The silicon carbide having two types of large and small particle sizes was used, whereby filling properties are raised, and further the alumina 7 was mixed, whereby the alumina 7 acts as a roller and the filling properties are more raised. Further, a surface of a thermal conduction sheet is flat to raise more the thermal conduction and raise insulating properties. <P>COPYRIGHT: (C)2003,JPO |
