发明名称 CUTTING UNIT FOR LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a cutting unit for a laminated electronic component, which is capable of perpendicularly cutting a ceramic laminated block with high accuracy into laminated ceramic chips. SOLUTION: Actuators 11 and 12 are driven to move guides 4 and 5 in a direction of canceling a horizontal component (component in the direction of the thickness of the cutting blade 2) of the reaction force, when a reaction force from a ceramic laminated block 25 to the cutting edge 2a of a cutting blade 2 starts becoming large, or when an obliquely cut surface of the laminated block 25 starts to become large in area. The reaction force acts in the direction in which it recedes from a positioning plate 21, so that the guides 4 and 5 are moved so as to approach the positioning plate 21. The cutting edge 2a of the cutting blade 2 is bent slightly, since it is controlled by guide faces 4a and 5a, and the cutting edge 2a penetrates obliquely into the ceramic laminated block 25 toward the positioning plate 21. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197492(A) 申请公布日期 2003.07.11
申请号 JP20010394816 申请日期 2001.12.26
申请人 MURATA MFG CO LTD 发明人 MATSUDA TOMOAKI
分类号 B28D1/22;B28B11/14;H01G13/00;(IPC1-7):H01G13/00 主分类号 B28D1/22
代理机构 代理人
主权项
地址