| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate delamination that may occur in a laminate due to a stress caused in the laminate by an endothermic reaction, when H<SB>2</SB>O breaks apart from metal hydroxide at degreasing time, when a laminated ceramic electronic component is manufactured by using a ceramic powder containing metal hydroxide. <P>SOLUTION: After the ceramic powder containing the metal hydroxide, for example, Gd(OH)<SB>3</SB>is heat-treated, the powder is used for manufacturing the laminated ceramic electronic component. Heat treatment is performed, at a temperature applied when the ceramic powder is heat-treated so that the peak of the metal hydroxide (Gd(OH)<SB>3</SB>) disappears and, in addition, the analysis result from which the generation of synthetic materials other then the oxide (Gd<SB>2</SB>O<SB>3</SB>) of the metal contained in the metal hydroxide is not confirmed may be obtained at the time of analyzing the ceramic powder by X-ray diffraction. <P>COPYRIGHT: (C)2003,JPO |
