| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a reinforced semiconductor substrate capable of suppressing the warping of a solar battery cell or the like after heat treatment, and inexpensively shortening the tact time of resin application. <P>SOLUTION: This method for manufacturing a reinforced semiconductor substrate is provided with an application process for applying heat-hardening materials such as epoxy resin to the surface of a semiconductor substrate, a first heat treatment process for carrying out the heat treatment of the semiconductor substrate at a first heat treatment temperature after application, and a second heat treatment process for carrying out the heat treatment of the semiconductor substrate at a second heat treatment temperature after the first heat treatment. The first heat treatment temperature is set so as to be higher than the second heat treatment temperature, that is, 110°C to 130°C, and the second heat treatment temperature is desired to be 90°C to 110°C. <P>COPYRIGHT: (C)2003,JPO</p> |
