| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of improving close adhesiveness between a copper patterning layer and a insulated resin layer without a process to form a coarse surface of the copper patterning layer surface through the chemical process using chemicals for a blackening process of the prior art in order to eliminate the problem that reduction of manufacturing period and manufacturing cost is dented. SOLUTION: There is provided a printed circuit board which has a structure where an insulated resin layer is formed by thermal drying process and has improved close adhesiveness between a copper pattern layer and the insulated resin layer by coating, on the surface of the copper pattern layer, of a build-up resin solution consisting of the resin composition, while the copper pattern layer surface is left unprocessed without any process to form the coarse surface such as the blackening process to the copper pattern layer surface, using the insulated resin consisting of a thermosetting resin composition in which a silane coupling agent resin composition is mixed in 0.01 wt.% to 10 wt.% as the essential element into the resin composition consisting of an epoxy resin and a phenol resin. COPYRIGHT: (C)2003,JPO |
