发明名称 |
LITHOGRAPHISCHE KONTAKTSTRUKTUREN |
摘要 |
A method of forming an interconnection, including a spring contact element, by lithographic techniques. The method comprises successively patterning a first and a second layer of masking material (125, 140) over a substrate (105), each layer of masking material having an opening; depositing a first conductive material (130) after patterning said first layer of masking material and depositing a second conductive material (145) after patterning said second layer of making material to form an electromechanical contact element having: a first portion (130) formed in an opening in said first masking material layer (125) and a second portion (145) coupled to the first portion and formed in an opening in said second masking material layer (140); and removing the plurality of layers of masking material. <IMAGE> |
申请公布号 |
DE69908638(D1) |
申请公布日期 |
2003.07.10 |
申请号 |
DE1999608638 |
申请日期 |
1999.12.01 |
申请人 |
FORMFACTOR, INC. |
发明人 |
MATHIEU, L.;ELDRIDGE, N.;GRUBE, W. |
分类号 |
G01R1/073;G01B7/34;G01N27/00;G01R1/067;G01R3/00;H01L21/48;H01L21/60;H01L21/66;H01L23/48;H01R12/16;H01R33/76;H05K3/32;H05K3/40;(IPC1-7):G01R1/067 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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