| 摘要 |
PURPOSE: A laminating apparatus is provided to stick circuit tape which a circuit film is stuck on a wafer where a number of semiconductor chips are formed to perfectly close to an exact standard position. CONSTITUTION: A laminating apparatus comprises: a tape sticking part(10) forming a circuit tape by sticking circuit film having circuit patterns and elastomer tape having adhesive materials; a punching press part(20) cutting a wire bonding region of the circuit tape with a punch and a die for bonding a bond finger of the circuit tape and input/output pads of the semiconductor chips formed on the wafer with the wire; wafer sticking part(30) aligning and sticking the circuit tape of which wire bonding region is removed and wafer having a number of semiconductor chips at the exact standard position; pressure applying part(40) applying pressure to stick the circuit tape fast to the wafer; and cutting part(50) removing useless circuit tape protruding from the wafer.
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