| 发明名称 |
INTELLIGENT POWER MODULE |
| 摘要 |
<p>The power part and the logic part of the module are arranged on different substrates. The circuit board ( 5 ) of the logic part has a recess ( 6 ) in which the power substrate ( 2 ) is located and electrically connected to the logic part by wire bonding techniques ( 7 ).</p> |
| 申请公布号 |
EP1192841(B1) |
申请公布日期 |
2003.07.09 |
| 申请号 |
EP20000935161 |
申请日期 |
2000.05.31 |
| 申请人 |
TYCO ELECTRONICS LOGISTICS AG |
发明人 |
FRISCH, MICHAEL |
| 分类号 |
H05K7/20;H01L25/07;H01L25/16;H01L25/18;H05K1/02;H05K1/14;H05K1/18;H05K3/46;(IPC1-7):H05K1/14 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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