发明名称 |
A circuit board manufacturing apparatus |
摘要 |
<p>The apparatus (1) has a solder printing station (2) at which solder paste is applied through a screen printing stencil in a desired pattern on to a circuit board. An optical scanning station (10) downstream of the soldering station (2) is operable to determine the volume of solder paste deposited at selected locations on the circuit board. A component machine (25) has means to pick and place a plurality of components at associated solder paste deposits on the circuit board. A re-flow oven (27) has means for heating and circulating air in a controlled manner in a number of heating zones and delivering circuit boards at desired speed through the heating zones to affect solder joints between the components and the circuit hoard. A wave soldering machine (28) is provided for attachment of components such as connectors which have conductor leads which pass through associated holes in the printed circuit board.</p> |
申请公布号 |
GB2347021(B) |
申请公布日期 |
2003.07.09 |
申请号 |
GB19990028454 |
申请日期 |
1999.12.01 |
申请人 |
* DOVATRON RESEARCH & DEVELOPMENT LIMITED |
发明人 |
JOHN * SCANLAN |
分类号 |
B23K1/008;B23K3/06;H05K1/02;H05K3/12;H05K3/30;H05K3/34;H05K13/08;(IPC1-7):H05K13/08 |
主分类号 |
B23K1/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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