发明名称 ELECTRODE STRUCTURE, AND METHOD FOR MANUFACTURING THIN-FILM STRUCTURE
摘要 A manufacturing method of an electrode structure and a thin-film structural body, which can remove a sacrifice film without removing other insulating films. An anchor hole which provides an opening to the surface of a wiring is covered with a sacrifice film and a nitride film. The anchor hole is constituted by a hole section formed in the nitride film and an opening of the sacrifice film. The hole section is opened to enter the wiring inward from an edge of the surface of the wiring by a first predetermined distance. The opening is opened to retreat from the hole section by a second predetermined distance. The existence of the first and second predetermined distances makes it possible to lengthen the entering distance to the oxide film of etchant to be used for removing the sacrifice film.
申请公布号 KR20030059159(A) 申请公布日期 2003.07.07
申请号 KR20037004514 申请日期 2003.03.28
申请人 发明人
分类号 H01L49/02;B81B3/00;H01L21/768;H01L29/84 主分类号 H01L49/02
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