| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method that allows conductive connection of an electric component and a board with high reliability without use of an adhesive, and a conductively connected structure. SOLUTION: The electronic component mounting method for conductively connecting an electronic component and a board using a conductive connection film in which conductive particles are disposed at random positions of a resin film, wherein each of the conductive particles comprises a core with the surface thereof being covered with a conductive layer having a thickness of 0.4μm or more, the conductive connection film is laminated between the electronic component and board, and ultrasonic vibrations which vibrate vertically relative to the laminating direction in an amplitude of 0.5-2μm is applied while pressure is applied in the laminating direction, thus performing conductive connection of the electronic component and the board. COPYRIGHT: (C)2003,JPO
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