| 摘要 |
<p>In the method of forming electrodeposited photoresist the operating temperature applied during the deposition is higher than Tmin, wherein Tmin is defined as the lowest temperature in a parabolic curve of temperature versus layer thickness of said photoresist. The resulting photoresist is substantially free of defects, and can be used for the provision of a patterned layer in an electronic device.</p> |
