| 摘要 |
PROBLEM TO BE SOLVED: To prevent the variation in within-plane uniformity of a plating film which is formed, by using a soluble anode as the anode, on the plane (surface) to be plated of a substrate accompanying the dissolution of the anode caused by the progress of plating. SOLUTION: This apparatus has a plating vessel 50 for holding a plating liquid Q; a substrate holder 52 arranged above the plating vessel 50 for freely detachably holding a substrate W with its plane to be plated kept downward; a plating liquid jet nozzle 60 for horizontally jetting the plating liquid from the periphery of the plating vessel 50 toward the center; a soluble anode 54 arranged and dipped in the plating liquid Q in the plating vessel 50; and a straightening plate 68 which is arranged above the anode 54 and below a plane formed by the plating liquid jet nozzle 60 and straightens the flow of the plating liquid Q. COPYRIGHT: (C)2003,JPO
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