| 摘要 |
Concave portions having shapes adapted to the remaining resist are formed in the vicinities of external terminals of metal wiring. The external terminals of the metal wiring project from the side surfaces of the concave portions. By thus constructing the external terminals, no matter which of the X, Y, and Z directions solder balls that are connected to lands displace in, the lands can displace by following the displacement of the solder balls without restriction. Therefore, even when the semiconductor device and a mounting substrate have elongation differently from each other due to a difference in the coefficient of thermal expansion, the elongation can be absorbed. |
