| 发明名称 |
Method of integrating a heat spreader and a semiconductor, and package formed thereby |
| 摘要 |
A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperature to form a heat spreader.
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| 申请公布号 |
US6586279(B1) |
申请公布日期 |
2003.07.01 |
| 申请号 |
US20000715360 |
申请日期 |
2000.11.17 |
| 申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
DAVIDSON HOWARD L.;LYTEL RICHARD |
| 分类号 |
H01L21/48;H01L23/373;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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