| 发明名称 |
AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p>An electronic assembly and a method of manufacturing such an assembly in which a carrier 13 for electronic components 14 and leads 18 for external connection are connected with each other by interconnections 19 including solder joints 22. In order to sustain heating periods, at least one of said interconnections comprises an adhesive joint 23 in addition to the solder joint applied between the carrier and one lead.</p> |
| 申请公布号 |
AU2002359207(A1) |
申请公布日期 |
2003.06.30 |
| 申请号 |
AU20020359207 |
申请日期 |
2002.12.19 |
| 申请人 |
TELEFONAKTIEBOLAGET L M ERICSSON |
发明人 |
PER FERM;JAN OHRN;FREDRIK WAHLEDOW;JAN FALLGREN;KARSTEN OVESEN;LARS GUSTAFSSON;MARKUS PERSSON;PER LUNDSTROM |
| 分类号 |
H01R4/02;H01R43/02;H05K3/30;H05K3/34;(IPC1-7):H05K3/34;H05K13/04;H05K3/36 |
主分类号 |
H01R4/02 |
| 代理机构 |
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