| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device tape carrier, which is capable of carrying out a flexible boring operation for each of products at a high speed, using an inexpensive boring tool. SOLUTION: A columnar bullet 6 as hard as metal or the like is made to fly by the use of the instantaneous pressure release of a high-pressure gas 8 and to impinge on an insulating sheet 20 as a material to be processed to penetrate through it, by which a fine hole nearly equal in size to the section of the bullet 6 is bored in the insulating sheet 20 for the formation of a semiconductor device tape carrier. COPYRIGHT: (C)2003,JPO
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