| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of preventing deformation of a lead of a semiconductor device in a characteristic test, and facilitating the lead adjustment work when testing the semiconductor device dismounted from a substrate. SOLUTION: In this manufacturing method of the semiconductor device wherein the semiconductor device formed by arranging a plurality of leads in a row on the periphery of a sealed body is stored in a socket and a test is performed by bringing the leads into contact with contact pins of the socket conductively, the socket having the contact pins provided thereon to be brought into contact with the leads on positions near the sealed body is used. Since the contact pins are brought into contact with the positions near the sealed body by this constitution, the leads have higher intensity compared with the case of a tip part, to thereby prevent deformation thereof. In addition, since a peripheral part of the sealed body is not fixed on the substrate, a position shift caused by deformation or adhesion of solder is not generated to thereby facilitate the lead adjustment work, when testing the semiconductor device dismounted from the substrate. COPYRIGHT: (C)2003,JPO
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