| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of large variations in adherence strength between a radiating electrode or a grounding conductor and a ceramic board in the manufacturing process, in which a step, such as a barrel polishing step, of removing inorganic powder remaining on the contacted face of a ceramic board after baking is necessary and there are variations in the surface roughness of a ceramic board according to a treatment time or a treatment position. SOLUTION: A projected part with a height of 0.03 to 0.3 mm is provided at a position 2 mm from the edge or closer on the side of the radiation electrode of the ceramic board. COPYRIGHT: (C)2003,JPO
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