| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining material suitable for joining an electronic component to a wiring pattern formed on a board. SOLUTION: A joining pattern is formed by printing resin-coated metal particles 10 each comprising a metal particle 1 having a melting point of 250°C or below and an average diameter of 0.1-20μm and a resin layer 2 covering it and having a melt viscosity of 500 Pa*s or less at 200°C on a circuit board 40 by using an electrophotography method. The electronic component 42 is disposed on the circuit board 40 by bringing it into contact with the metal particles 10. When they are heated to a temperature of 200-230°C, the metal material 1 and the resin 2 are melted, and the metal material 1 is fused together. When they are cooled, the metal material 1 is solidified, and the electronic component 42 is joined to the circuit board 40. The resin 2 is easy to separate from the metal particle 1 as a layer because its melt viscosity is low, so that the metal particles 1 are made easy to fuse together. COPYRIGHT: (C)2003,JPO
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