发明名称 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a high sensitivity chemically amplified positive resist composition capable of efficiently forming an ultrafine resist pattern faithful to a mask pattern and having a good section shape. <P>SOLUTION: The chemically amplified positive resist composition comprises (A) a copolymer resin component comprising 50-85 mol% hydroxyl-containing styrene units, 15-35 mol% styrene units and 2-20 mol% acrylic or methacrylic ester units having a dissolution inhibiting group which can be released by an acid, (B) a photoacid generator comprising an onium salt containing a fluoromethylsulfonate ion as an anion and (C) a tertiary alkanolamine. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003177541(A) 申请公布日期 2003.06.27
申请号 JP20020338034 申请日期 2002.11.21
申请人 TOKYO OHKA KOGYO CO LTD 发明人 OMORI KATSUMI;YUGAWA HIROTO;UCHIDA RYUSUKE;SATO KAZUFUMI
分类号 G03F7/039;C08F214/14;G03F7/004;H01L21/027 主分类号 G03F7/039
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