Room temperature curable organopolysiloxane compositon

摘要

A room temperature curable organopolysiloxane composition of the ketone removal type comprising a diorganopolysiloxane having a minimized content of low-molecular-weight organopolysiloxanes as a base polymer, and an alkenoxysilane as a crosslinking agent does emit essentially no low-molecular-weight siloxanes and organic matter with the passage of time after curing and is suitable for use as a sealant in a clean room and as a sealant or adhesive on electrical and electronic parts.