| 摘要 |
PURPOSE: A method for depositing electroless gold layers having increased adhesion as compared to conventional electroless gold deposits on a metal substrate using a catalytic palladium deposit is provided. CONSTITUTION: The method comprises the steps of (a) contacting the metal with a palladium bath; and (b) then contacting the metal with an electroless gold plating bath, wherein the metal is contacted with the palladium bath for a period of time sufficient to deposit palladium seeds or a discontinuous palladium layer. The method of manufacturing an electronic device comprises the steps of (a) contacting a metal layer disposed on an electronic device substrate with a palladium bath; and (b) then contacting the metal layer within electroless gold plating bath, wherein the metal layer is contacted with the palladium bath for a period of time sufficient to deposit palladium seeds or a discontinuous palladium layer.
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