发明名称 ELECTRONIC PART ELEMENT, MANUFACTURING METHOD THEREFOR AND ELECTRONIC PART DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic part element where the occurrence of a crack in a piezoelectric substrate can be reduced and yield can be improved, and to provide the manufacturing method and an electronic part device using it. SOLUTION: Draw-out electrodes 4c and 5c for surface acoustic wave filter are disposed on the piezoelectric substrate 3. An input electrode 6 and a ground electrode 8 as electrode pads for electrically connecting the draw-out electrodes 4c and 5c with an outer part are arranged for phase down mounting by metal bumps 10. In the electrode pads, a part of the electrode pads is overlapped with the draw-out electrodes 4c and 5c of two-layered structure constituted of Al or Al alloy layers 12 and Ti layers 11 as bases. The electrode pads have pad electrode layers 13 and 16 formed of Al or Al alloy, and barrier layers 15 for suppressing the diffusion of the metal bumps arranged on the electrode pads. The barrier layers 15 are disposed in the middle of the pad electrode layers 13 and 16. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003174056(A) 申请公布日期 2003.06.20
申请号 JP20010374516 申请日期 2001.12.07
申请人 MURATA MFG CO LTD 发明人 SAKAGUCHI KENJI
分类号 H01L21/60;H03H3/08;H03H9/145;H03H9/25;(IPC1-7):H01L21/60 主分类号 H01L21/60
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