| 摘要 |
<p>A mold for underfill encapsulation process of multi flip chip is disclosed. The mold has a multiplicity of cavities, in each of which each of said semiconductor chips is accommodated; a multiplicity of encapsulant inlets for guiding the injected encapsulant into said cavities; and a multiplicity of encapsulant outlets for exhausting the encapsulant and air in said cavities to the outside of said cavities. The mold for underfill encapsulation process of multi flip chip in accordance with the present invention is able to encapsulate numbers of flip chips at the same time, and thus it reduces the processing time required for encapsulation process and thereby remarkably improves the overall productivity.</p> |
