| 摘要 |
PURPOSE: A method for fabricating substrate stacked with copper foils is provided to prevent a side etching effect and the undesirable enlargement of through- hole and reduce the unnecessary time by using thin copper foils. CONSTITUTION: The first and the second carriers having the first and the second flat surfaces are prepared. The first and the second thin metal layers are formed on the first and the second carriers. The first and the second copper layers(4,4') are formed on the first and the second thin metal layers by using an electric plating method. A resin sheet type prepreg is inserted between the first assembly including the first carrier, the first metal layer, and the first copper layer(4) and the second assembly including the second carrier, the second metal layer, and the second copper layer(4'). The first and the second copper layers(4,4') come in contact with both sides of the prepreg. The first assembly, the second assembly, and the prepreg are pressed by the heat. A processed resin material(6') is formed by performing the heat press process. The first and the second metal layers and the first and the second carriers are removed therefrom.
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