Laser processing device used for laser welding, cutting or boring has a measuring system partially connected to the laser processing unit to acquire three-dimensional surface data or oscillations

摘要

Laser processing device comprises: a laser processing unit (2) for producing a beam (2.1) deviated on a processing site of a workpiece (3); and a measuring system (4) having an illuminating unit and an observation unit for acquiring surface data of the workpiece in the region of the processing site. The measuring system is partially connected to the laser processing unit to acquire three-dimensional surface data or oscillations. The measuring system is in the form of a interferometer with a short coherent light source as white light interferometer. Preferred Features: Illumination and observation with the measuring system is in the same direction. A beam splitter (2.2) is arranged in the laser processing unit. The processing laser is used as the illumination unit.