Production of semiconductor wafers made from silicon comprises sawing a single crystal made from silicon into silicon wafers, forming a mechanical cut on both sides of the wafers, polishing using polishing plates, and surface polishing

摘要

Production of semiconductor silicon wafers made comprises: sawing a silicon single crystal into wafers using a wire cutter; forming a mechanical cut on both sides of the wafers to a depth of at least 20 microns ; simultaneously polishing the front and rear sides of the wafers between polishing plates with introduction of polishing agent containing abrasive material or colloids; and surface polishing at least the front side of wafers. Preferred Features: The polishing plates have a polishing cloth with a Shore A hardness of 40-60 and a smooth polyurethane surface having a pore diameter of 50-500 microns without a macroscopic texture. An Independent claim is also included for a semiconductor wafer produced by the above process.