| 摘要 |
<p>System and method for laser micro-machining of crystalline and polycrystalline materials such as silicon that produces smooth surfaces. The invention is applied to integrated circuit applications including probing or modification of circuit components, electrical connections through silicon substrates, establishing ground plains within integrated circuits, and connections between circuits developed on opposing sides of a single substrate. Methods involve the use of femtosecond light pulses of short wavelength and circular polarization. A specific fluence region is used to obtain machined surfaces with smoothness to within one micron.</p> |
