| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for cutting the lead electrode of a semiconductor device capable of easily and surely removing and recovering cutting chips even when the chips generated at the cutting of the lead electrode are short. SOLUTION: The apparatus is used for cutting the lead electrode of the semiconductor device 1 such as an IC. The apparatus comprises a cutting die having a die 5 and a punch 3 for cutting the lead electrode 2 of the semiconductor device 1 in a predetermined length, and cutting chips recovering mechanisms 6, 7 for recovering and removing the chips 8 of the electrode 2 generated by cutting. The die 5 is horizontally slidably constituted. Cutting chip removing means (cutting chip stopper) 6 of the mechanism 6, 7 is provided to be brought into contact with the slide surface of the die 5, brought into contact with the chips 8 adhered to the die 5 to remove and recover the chips 8 from the die 5. COPYRIGHT: (C)2003,JPO
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