| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing end point detecting method and a polishing end point detecting apparatus that can accurately detect a polishing end point. <P>SOLUTION: White light from a light source unit 32 is applied to a wafer W that is polished through an observation window 26 formed at a polishing pad 16, and its reflection light is subjected to a spectrophotometry analysis, thus detecting the polishing end point of the wafer W. At this time, the quantity of reflection light is measured, and the luminance of the light source unit 32 is corrected so that the quantity of reflection light is fixed, thus accurately detecting the end point. <P>COPYRIGHT: (C)2003,JPO |
