Contact bump formation by electroless deposition uses resist which is structured to define deposition surfaces and penetrating, confining sidewalls

摘要

Before electroless deposition of the first electrically conductive material, a resist layer is applied to the surface (2) of the substrate (1). This is structured to lay bare the metallization surfaces (3). The structuring forms penetrating depressions with steep sidewalls. Into these, the first electrically conductive material is deposited electrolessly. An Independent claim is included for the contact bump produced.