| 发明名称 |
COMPOSITIONS AND METHODS FOR FORMING DIELECTRIC LAYERS USING A COLLOID |
| 摘要 |
<p>A colloid composition can be used to form a thin film on a substrate. The colloid can be colloidal silica. The thin film can be a dielectric layer. The substrate can be a semiconductor substrate having gaps thereon.</p> |
| 申请公布号 |
AU2002337882(A1) |
申请公布日期 |
2003.06.10 |
| 申请号 |
AU20020337882 |
申请日期 |
2002.10.16 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BYUNG HWANG;KERMIT KWAN;ZHONGTAO LI;ERIC MOYER;SHENG WANG;DAVID WYMAN;XIAOBING ZHOU |
| 分类号 |
H01L21/316;H01L21/762;(IPC1-7):H01L21/316;H01B3/10 |
主分类号 |
H01L21/316 |
| 代理机构 |
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代理人 |
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| 主权项 |
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