发明名称 LASER BEAM MACHINING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To enable laser beam machining with high accuracy by making an object to be machined on a stage flat regarding a laser beam machining system in which prescribed machining is executed by conveying a single object to be machined on the stage and irradiating a laser beam. <P>SOLUTION: The system is so constituted that when the object to be machined (paper) conveyed by a conveying means 13 is laid on the stage 12, at least a prescribed part of the outer periphery of the object to be machined is sucked and fixed by suction means 17 (16) via an outer suction hole 23 and the prescribed laser beam machining is executed by a laser beam irradiation means 15. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003164988(A) 申请公布日期 2003.06.10
申请号 JP20010362298 申请日期 2001.11.28
申请人 TOPPAN FORMS CO LTD 发明人 HIROHATA WATARU
分类号 B23K37/00;B23K26/10;(IPC1-7):B23K26/10 主分类号 B23K37/00
代理机构 代理人
主权项
地址