| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board assembly, which supports a column grid array integrated circuit against compressive force, such as would be exerted by a cooling means or the like mounted to the CGA circuit integrated array. SOLUTION: The circuit board assembly (8) has a circuit board (22) and a column grid array (CGA) integrated circuit package (10). The CGA integrated circuit package (10) has a substrate (12) having an array (16) of solder columns (18) extending from a bottom surface (20). An oversized lid (14) is affixed to the substrate (12). Support shims (30) are disposed between a portion (29) of the lid (14) that extends beyond an outer periphery (28) of the substrate (12) and a circuit board (22) to which the CGA integrated circuit package (10) is mounted. The support shims (30) are affixed to the lid (14) with an adhesive (38) after the CGA integrated circuit package(10) is mounted on the circuit board (22). The adhesive (38) accommodates any variations in height in the CGA integrated circuit package (10). COPYRIGHT: (C)2003,JPO
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