| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board manufacturing method capable of preventing the occurrence of a positional deviation between a through hole and via hole. SOLUTION: An aperture 42 for a via hole is formed on an inter-layer resin insulating layer 40 formed on the surface of a core substrate 30 by using a laser processor. Through holes 46 are formed on the front and rear of the aperture 42 by using the same laser processing device. Consequently a positional deviation between the through hole and the via hole can be removed. COPYRIGHT: (C)2003,JPO |
