发明名称 CERAMIC BOARD FOR THERMOELECTRIC CONVERSION MODULE
摘要 PROBLEM TO BE SOLVED: To efficiently transmit the heat of a heater such as an optical semiconductor element or the like to the exterior by not concentrating a thermal stress generated by a thermal expansion difference between the ceramic board and an electrode and a thermal stress generated by the thermal expansion difference between the electrode and a thermoelectric element at the junction of the electrode and the board. SOLUTION: The ceramic board for the thermoelectric conversion module comprises a copper layer 2b laminated on a metallized layer 2a on one main surface of the ceramic board 1, a plurality of the electrodes 2 consisting of 2a and 2b and having the thermoelectric element 3 fixedly mounted on the upper surface and independently formed. In this board, the electrodes 2 are formed with skirt parts 4 made of recessed curved surface over the entire periphery of the outer peripheral end of the metallized layer 2a, and the board 1 is formed with a skirt extended part 5 having a recessed curved surface continued from the peripheries of the electrodes 2 of the main surface to the skirt parts 4. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003163384(A) 申请公布日期 2003.06.06
申请号 JP20010363239 申请日期 2001.11.28
申请人 KYOCERA CORP 发明人 KATABE KOSUKE
分类号 H01L23/12;H01L23/38;H01L23/40;H01L35/08;H01L35/32;H01S5/024;(IPC1-7):H01L35/32 主分类号 H01L23/12
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