| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging device in which a solid state image sensor having a reliable hermetic sealing is mounted readily and accurately on a package and a thin package can be realized. SOLUTION: A flat part 4 of glass is placed on a solid state imaging chip 1, bumps 7 provided on the solid state imaging chip are connected electrically with metal wiring 6 formed on the flat part, a solid state image sensor 9 having a hermetic sealing formed by sealing the joint with a sealant 8 is mounted on a package 12 having a positioning reference face 16 while positioned thus constituting a solid state imaging device. COPYRIGHT: (C)2003,JPO |
