| 摘要 |
A dual band microstrip antenna (1) has a dielectric substrate (11), a ground plane (10) attached to a bottom surface (111) of the substrate, a first and second radiating patches (21, 22), a first and second conductive posts (23, 24), and a first and second feeder cables (25, 26). The conductive posts each separately elevate a corresponding radiating patch an appropriate height above and parallel to a top surface (110) of the substrate, and electrically connect each radiating patch to the ground plane. Feeder inner conductors (250, 260) are soldered to their respective radiating patches and feeder outer conductors (251, 261) are soldered to the ground plane. Impedance matching is achieved by selecting an appropriate distance between the solder positions of the posts and inner conductors on each radiating patch.
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