Resin diamond blade and optical waveguide manufacturing method using the blade

摘要

A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 mum or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm<=t2<=t1+0.05 mm.