发明名称 METHOD AND DEVICES FOR QUALIFYING SUBSTRATE-PROCESSING PRODUCTION PROCESSES
摘要 The invention relates to a method for qualifying substrate-processing production processes by means of a sensor plate. In this case, the term substrate refers to the carrier plates, for example, of printed circuit boards on which components are to be mounted. The term qualification refers to the determination of measuring values which provide information about the quality of the method and the components (14) used for the method. In order to enable the sensor plates (17, 18) to be used in the most versatile manner possible, said sensor plates are used to transfer media onto the substrate, to apply masks to the substrate or to position the substrate in the production device (11). The sensor plates can replace the substrate or be arranged near the surface of the substrate. According to the invention, the sensor plates used comprise a matrix of sensor elements which are sensitive in terms of capacity or temperature, and enable a high resolution on the sensor plates.
申请公布号 WO03047328(A2) 申请公布日期 2003.06.05
申请号 WO2002DE04308 申请日期 2002.11.20
申请人 SIEMENS AKTIENGESELLSCHAFT;MEIER, HARTMUT;MUELLER, BERND;WITTREICH, ULRICH 发明人 MEIER, HARTMUT;MUELLER, BERND;WITTREICH, ULRICH
分类号 H05K1/02;H05K3/34;H05K13/08 主分类号 H05K1/02
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