发明名称 Vorrichtung und Verfahren zum Bestücken von Substraten mit elektrischen Bauelementen mittels in zwei parallelen Führungsbahnen verschiebbaren Bestückköpfen
摘要 The invention relates to a device comprising two closely-adjacent parallel guide tracks (3) for insertion heads (4), which can be independently displaced in said tracks without risk of collision in a closely laterally separated manner. Grippers (6) for manipulating components are arranged on the mutually facing longitudinal sides of said insertion heads (4). Said guide tracks (3) extend above pick-up points (10) of the components and above insertion zones, where substrates (2) can be positioned perpendicularly to the displacement direction of the insertion heads (4). By means of the present invention, said substrates (2) can be simultaneously equipped by two insertion heads in a minimum of space.
申请公布号 DE10156266(A1) 申请公布日期 2003.06.05
申请号 DE20011056266 申请日期 2001.11.16
申请人 SIEMENS AG 发明人 AIGNER, SEBASTIAN;MEHDIANPOUR, MOHAMMAD
分类号 H05K13/04;(IPC1-7):H05K13/02 主分类号 H05K13/04
代理机构 代理人
主权项
地址