发明名称 Laser diode package with heat sinking substrate
摘要 Thick metal plates are used both as leads and substrate of a laser diode package. The laser diode and the metal plate are covered with a sealing glue up to the outside end of the laser diode to form a unitary structure. The thick metal plates serve as a heat sink. The outside end of the laser diode is not covered with glue so that the emitted is not attenuated. A photo diode is used to monitor the emitted light intensity. The photo diode can share a common electrode with the laser diode by mounting the photo diode on a step-down metal plate, so that the light emitted from the inside end of the laser diode is only partially blocked.
申请公布号 US6574254(B1) 申请公布日期 2003.06.03
申请号 US20020068531 申请日期 2002.02.08
申请人 HARVATEK CORP. 发明人 WANG BILY
分类号 H01S5/02;H01S5/024;(IPC1-7):H01S3/04 主分类号 H01S5/02
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