| 摘要 |
The present invention provides a ball grid array semiconductor package having a resin coated metal core substrate. The semiconductor device comprises a resin coated metal core substrate, solder balls, chip adhesive material, at least one semiconductor chip, bonding wires, and encapsulant. The metal core is made from a conductive material, for example, a metal lead frame and coated with a resin to form a resin covered metal core substrate structure. The resin coating covers both sides of the metal core except for selected areas of the metal core, such as where it is desired to attach the bonding wires or the solder balls. A liquid encapsulant is formed to cover desired areas of the resin coated substrate, bonding wires, adhesive material, and the semiconductor chip. Since the outer surface of the substrate is substantially of resin material, the adhesion between the substrate and the encapsulant is much stronger than if a standard conventional substrate was used. Due to the resin coated metal core, the semiconductor device has improved thermal performance, higher reliability, and lower cost. |
