| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having a small warpage after molding or soldering, excellent in reliability after soldering and suitable for area-mount type semiconductor device. SOLUTION: The area-mount type semiconductor sealing epoxy resin composition comprises an epoxy resin (A), a phenol resin (B), an accelerator (C) and an inorganic filler (D) as essential components. Particles having a particle size of 0.5μm or less are included in 2-15 wt.% of the total inorganic filler (D). The total inorganic filler (D) is included in 80-94 wt.% of the total epoxy resin composition. Volatiles in the epoxy resin composition is 0.02-0.10 wt.%. COPYRIGHT: (C)2003,JPO
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