| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating a multi-layer printed wiring board for confirming that circuit width and inter-layer thickness satisfy a design value, by measuring the impedance of a copper-clad laminate with an internal layer circuit in a step where the copper-clad laminate with the internal layer circuit is obtained in the intermediate step of the manufacturing of a multi-layer printed wiring board. SOLUTION: In a process for manufacturing a multi-layer printed wiring board having a process for forming a circuit on a copper-clad laminate with an internal layer circuit, the internal layer circuit layer of the copper-clad laminate with the internal layer circuit is provided with a pattern for measuring an impedance. In this method for evaluating a multi-layer printed wiring board, the impedance measurement of the pattern for measuring the impedance exposed to the cross-section of the edge part of the copper-clad laminate is carried out by using whole copper foil parts on the both faces of the copper-clad laminate as a ground layer. |
