| 摘要 |
PROBLEM TO BE SOLVED: To easily detect leakage failure in a digital circuit after packaging chips in a semiconductor device where an analog circuit and a digital circuit are integrated into one chip and at the same time a power supply terminal is shared while chips have been packaged. SOLUTION: In inspection, a transistor 17 that is arranged in a power supply line from a power supply terminal 13 to a digital circuit 11 is turned off for breaking, at the same time a supply voltage is applied to the power supply terminal 13 while the digital circuit 11 is being set to a test mode, and current leakage in the digital circuit 11 is detected by potential difference that is generated in a detection resistor 28 that is connected in parallel with a break section at the power supply line from the power supply terminal 13 to the digital circuit 11.
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