| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device reduced in cost by decreasing the area of a semiconductor chip. SOLUTION: The tip end 8b of a bonding wire is bent with respect to the main body unit 8a as shown in (a) in the semiconductor device and, therefore, the tip end 8b of the bonding wire 8 is not projected toward the side of an emitter electrode 15. An area, into which the tip end 8b of the bonding wire 8 is projected in a conventional technique, becomes unnecessary. Accordingly, the area of the semiconductor chip 1 can be decreased and the cost can be reduced. |
