| 摘要 |
<p>A method and apparatus (100) for 'through-the-pad' delivery of slurry polishing agents directly to the land areas of a polishing pad (1305) is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove (1310) modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad (1305) and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.</p> |
